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          1. IGBTTag
            首頁 > Tag標簽 > IGBT
            222021-10
            基于高性能小型PQFN封裝,芯能半導體最新推出了4A/600V半橋IPM產品XNS04H54D6。將有助于進一步實現高速風筒和風機等產品的低功耗、小型化及輕量化。芯能在隔離封裝中提供了一種非常緊湊、高性能的半橋拓撲。將Trench.. MORE
            芯能半導體PQFN產品在風筒上的應用
            072021-09
            2021年9月6日,芯能完成C輪過億元融資資金交割。C輪融資由元禾重元、飛圖資本聯合投資,老股東方廣資本和深圳高新投持續加注。 MORE
            芯能半導體完成C輪融資
            142021-08
            通過持續不斷的產品研發投入,芯能半導體首批基于12英寸Field-Stop Trench IGBT芯片正式下線。此次芯片的成功下線,為芯能后續的產能提升開拓出新的方向。 MORE
            芯能成功產出12寸IGBT芯片
            192021-07
            深圳芯能半導體技術有限公司聯合深圳市金威源科技股份有限公司成立“金威源科技-芯能半導體聯合應用實驗室”,揭牌儀式同時隆重舉行。 MORE
            “金威源-芯能半導體聯合應用實驗室”成立
            232021-02
            我們提供一種集成電源+功率模組的應用方案,體積小,功能齊全的應用方案。該方案集成IPM、整流橋、母線電壓采樣電路、相電壓采樣電路、電流采樣、預充電路、繼電器輸出、電源電路。 MORE
             芯能IPM模塊在電機控制器的應用方案
            052021-01
            2020年12月30日,芯能完成B輪和B+輪近億元戰略融資全部交割。B輪融資由老股東獵鷹投資攜手勁邦資本和冠亨投資聯合投資。B+輪融資由美的資本獨家投資。 MORE
            芯能半導體完成戰略融資
            092020-11
            2020年11月6日,“2020先進材料與芯片技術學術研討會暨學科建設研討會”在深圳技術大學開幕。深圳技術大學校長阮雙琛,副主任徐剛;中國工程院院士、廣東省科協副主席周克崧,中國工程院院士、深圳大學微納光電子研.. MORE
            2020先進材料與芯片技術學術研討會
            182020-09
            “在不同的應用場景下,電力轉換設備中對功率器件特性需求有差異。在一些電源類領域中,需要提高載波頻率來提升整個系統的性能及優勢,此時對功率器件的動態性能有較高要求;一些電機驅動領域中,一定的載波頻率足夠.. MORE
             芯能新一代微溝槽技術1200V IGBT芯片研發成功
            292020-04
            2020年4月29日,中國航天國際控股有限公司董事局主席劉眉玄主席一行來到芯能半導體參觀指導。芯能半導體總經理劉杰和芯能全體同事對劉主席一行的到訪表示熱烈歡迎。雙方就國內功率半導體行業的發展和趨勢、以及芯能.. MORE
            歡迎中國航天國際控股有限公司劉主席一行蒞臨芯能參觀指導
            172020-03
            芯能發布汽車級大功率IGBT芯片
            132019-10
            國慶、重陽剛過,節日氣氛未褪,芯能的MM們乘興組織了一場說走就走的團建活動,地處南海之濱,親海之旅是順利成章的選擇。云海深處有山莊大部隊浩浩蕩蕩開赴云海山莊,一路暢談大鵬半島日新月異的變化。搭乘特區號快.. MORE
             侶清風友碧?!灸馨雽w大鵬半島團建
            182019-06
            From June 14th to June 16th, 2019, Core Energy Semiconductor joined hands with Core Electronics to participate MORE
            Xiner joins the core electronics to participate in Shenzhen Semiconductor Exhibition
            312019-05
            Is the module solution costly? Is the single tube design complicated? Is the heat dissipation problem tricky? Insulation cloth is easy to age? Ceramic insulation sheets are easy to break? MORE
            Xiner introduces a series of ceramic internal insulation IGBT products
            032019-12
            The production process and technology of silicon carbide (SiC) devices have become increasingly mature, and the biggest obstacle to market promotion is cost. MORE
            Why are SiC devices not yet replacing IGBTs?
            032019-12
            Since the working state of the power electronic device has four working states: on, on state, off state, and off state, the interrupt state and the on state are respectively subjected to high voltage and large current MORE
            What are the common snubber circuits for IGBTs?
            032019-12
            the need to reduce costs. Taking two points as an example, directly purchasing the finished module of SEMIKRON and other manufacturers can improve the stability of the product MORE
            What are the benefits of connecting two IGBT modules in parallel to replace one IGBT?
            032019-12
            Due to the trade-off between UCE (sat) and short-circuit tolerance of IGBT, it is recommended to select the gate voltage as +UG=15V±10%,—UG =5~10V. MORE
            What are the safe working conditions for IGBTs?
            032018-12
            The gate of this shape forms a JFET structure as previously described, as well as a weak conductance modulation effect in the emitter region. For planar gate IGBTs, the concentration of carriers gradually decreases from collector to emitter. MORE
            What is a trench gate structure (Trench) IGBT?
            032018-12
            Support household induction cooker for 2100w high power applications MORE
            IGBT induction cooker application
            182019-06
            芯能半導體攜手有芯電子參加在深圳·會展中心舉辦的2019第二屆深圳國際半導體展覽會。 MORE
            IGBT中國芯 ——芯能攜手有芯電子參加深圳半導體展
            312019-05
            ——導熱率高、加工更簡單模塊方案成本高?單管方案設計復雜?散熱問題棘手?絕緣布易老化?陶瓷絕緣片容易碎?做電機驅動的各位朋友想必都體會過以上的煩惱。隨著市場競爭的逐步加劇,在電機驅動器市場單管方案也越.. MORE
            芯能推出系列陶瓷內絕緣IGBT產品
            212019-01
            Xiner IGBT Discretes products are available in the following package formats: TO-252, TO-263, TO-264, TO-220, TO-220F, TO-263, TO-247, TO-3P, IITO-3P, etc. MORE
            IGBT Discretes
            212019-01
            Xiner IGBT module, PIM,C1,C2,C3,C4,C5,L1,L2,and other exterior models. MORE
            IGBT Module
            212019-01
            芯能IGBT單管產品現有封裝形式包括:TO-252,TO-263,TO-264,TO-220,TO-220F,TO-263,TO-247,TO-3P,IITO-3P等 MORE
            IGBT單管
            212019-01
            芯能IGBT模塊,PIM,擁有C1,C2,C3,C4,C5,L1,L2等幾種外型型號產品。 MORE
            IGBT模塊
            精品无码国产AV一区二区三区,JIZZZZ在线无码 观看,人与动人物XXXX毛片人与狍